Infinera is committed to developing the networks of the future. With our uniquely differentiated PIC technology, we have created a Digital Optical Networking system with more speed, capacity and scalability than ever before. The latest generation of Infinera’s digital optical network, the DTN-X, was released in Mid-2012 and has seen enormous traction with network providers. In less than a year, Infinera is already the global market leader in 100G Long-Haul optical transport networks. Despite such success, we believe that photonic integration is still in its infancy and are looking for highly motivated individuals to join us in developing the next generation of PICs.
The successful candidate will work within the PIC design and engineering team and engage in simulation, data analysis and lead product development from design concept through to the manufacturing phase.
Position responsibilities include:
Hands-on work in designing of integrated photonic components, developing PIC fabrication processes, implementing PIC processes through the fab, and testing and characterization of the resulting circuits to verify performance.
A strong understanding of optical components design, fabrication and test.
Strong background with semiconductor optical devices such as laser, detectors, modulators and other integrated waveguide devices.
Use of optical and electronic modeling and simulation software to design electro-optical devices, and lithographic mask specification, design and pattern generation.
Familiarity or direct experience in most of the standard III-V process technologies required for fabrication of electro-optical devices including epitaxial growth, metallization, wet/dry etching, photolithography, and dielectric coating.
Familiarity or direct experience in device characterization and automated testing as required in design and development.
Experience in creating designed experiments to map device performance as a function of epitaxial structure and fabrication parameter space.
Familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
Ability to work in an integrated team environment.
Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
Job will require frequent interaction with fab, epitaxy and test engineering, packaging and system engineering groups, as well as with quality/reliability and product engineering personnel.