The Optical Integrated Circuit Group at Infinera is looking for individuals to engage in the development of the next generation large-scale PIC platform.
The individual will work with the PIC design and engineering team in designing integrated photonic components, developing PIC fabrication processes, implementing PIC processes through the fab, and engaging with the process integration team in transferring processes to manufacturing.
Additional responsibilities will include device simulation, data analysis, leading product development from design concept through to the manufacturing phase and overseeing the testing and characterization of device performance
A strong understanding of optical components design, fabrication and test.
Strong background with semiconductor optical device manufacturing such as laser, detectors, modulators and other integrated waveguide devices.
Experience in III-V process technologies required for fabrication of electro-optical devices including epitaxial growth, metallization, wet/dry etching, photolithography, and dielectric coating.
Experience in the development of new process integration schemes and transferring processes to manufacturing
Familiarity or direct experience in device characterization and automated testing as required in design and development.
Experience in creating designed experiments to map device performance as a function of epitaxial structure and fabrication parameter space.
Familiarity with optical components testing methodology including equipment setup, algorithms and sensitivity analysis.
Possess III-V device fundamentals and knowledge of failure modes
Use of optical and electronic modeling and simulation software to design electro-optical devices, and lithographic mask specification, design and pattern generation.
Ability to work in an integrated team environment.
Ability to work with a large body of data and the necessary statistical analysis tools, and the ability to present the data and ideas to a diverse audience.
Job will require frequent interaction with fab, epitaxy and test engineering, as well as with quality/reliability and product engineering personnel.
M.Sc. or Ph.D. in Electrical Engineering, Photonics, Physics, or Materials Science
Minimum of 3 years of hands-on experience in semiconductor device manufacturing and process integration
Internal Number: 201847
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