Intel's Silicon Photonics Product Division is seeking a seasoned R&D engineer to drive package assembly and process development for our most advanced optical interconnect products. You will be part of a multi-disciplinary team that owns the definition, demonstration, and productization of ultra high bandwidth, low-cost transceivers that unleash the potential of SiPh for data center connectivity. You will provide IC and optical packaging process development leadership* define assembly-related DFx design rules and BKMs for IC and package designs. Own wafer and chip level packaging as well as the integration of electrical ICs, optical ICs and transceiver components into the final integrated package with a specific focus on assembly technology and process flows. Engage internal stakeholders and external vendors to define assembly processes consistent with component requirements, technology capabilities and product requirements* devise assembly test vehicles and functional builds to validate package designs as well as assembly processes http://career.intel.com/tp/rj6.mRQoB.e.K
MS/PhD in Materials/Mechanical/Electrical Engineering or related fields
6+ years of experience in advanced SOC packaging, optical component packaging and assembly process development
Experience with a wide variety of advanced flip chip IC packaging techniques such as C4, copper pillar bonding, thermo-sonic bonding and 2D/3D assembly Deep knowledge of advanced substrate materials such as ceramics, HDI packages and advanced organic materials In-depth understanding of assembly process flow details, challenges, limitations and tradeoffs
Proven track record of engaging and managing multiple vendors in a highly matrixed environment to drive complex assembly concepts through to demonstration and product deployment
Demonstrated track record of informed risk taking to be successful in this advanced development environment
Be comfortable in helping define constraints which determine the available solution space
Strong written and verbal communication skills, strong interpersonal skills, the ability to make and meet commitments
Willingness to travel
Intel® Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration. Since announcing the world’s first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!
Internal Number: JR0055288
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