Intel's Silicon Photonics Product Division is seeking a seasoned technical leader in optical transceiver design to help define architecture and drive development of our most advanced optical interconnect products to transform data center connectivity. These products are ultra high bandwidth density and low-cost and require key innovation in architecture, optical component, IC, module packaging, test, and manufacturing. You will be a key technical leader on this multi-disciplinary R&D team and will be responsible for providing high speed system and transceiver integration leadership. Defining overall transceiver design and individual component specifications consistent with technology capabilities and product performance, cost and power requirements. Defining and aligning internal and external interface specifications with key focus on electrical and high speed. Developing architectural guidelines and design models to accelerate DOE definition and design iterations. Owning and driving detailed transceiver design, tapeout, and performance validation at all phases of product development life cycle from concept to product Identifying technical risks and resolution/mitigation paths
MS or PhD in Electrical Engineering, Physics or closely related technical disciplines
Minimum 6 + years experience in the optical industry to include fiber optics, optical networking, optical and RF modulation, and data networking architectures
System knowledge of current generation and next generation optical transceiver architectures, standards, designs and tradeoffs. Experience with different PAM4/NRZ modulation formats and high speed/RF design of optical transceivers with a proven track record of successful product introduction
Deep understanding of Signal Integrity, Power Integrity and Channel modeling using industry standard tools such as HFSS and ADS
Experience working closely with circuit designers on the design of analog RF front end circuits such as Drivers, Trans-Impedance Amplifiers TIA and limiting amplifiers Good understanding of low noise PLL's and clocking and data recovery architectures
Possess first level IC package design experience including package design and analysis, as well as experience with a wide array of IC package technologies including 2D/3D packaging techniques
Experience with a wide array of optical components and PHY level components including ROSA/TOSA/BOSA sub-components, modulators, passive waveguide componentsUnderstanding of optical polarization impacts, link impairments and link power/OSNR budget estimation
Strong written and verbal communication skills, with the specific ability to communicate and lead effectively across dispersed, multi-disciplinary teams
Possess excellent time and task management skills, strong inter-personal skills and a willingness to travel when required.
Internal Number: JR0055930
About Intel Corporation
Intel makes possible the most amazing experiences of the future.
You may know us for our processors. But we do so much more. Intel invents at the boundaries of technology to make amazing experiences possible for business and society, and for every person on Earth.
Harnessing the capability of the cloud, the ubiquity of the Internet of Things, the latest advances in memory and programmable solutions, and the promise of always-on 5G connectivity, Intel is disrupting industries and solving global challenges. Leading on policy, diversity, inclusion, education and sustainability, we create value for our stockholders, customers and society.